PCB board is an important carrier of electronic components and an important circuit connection element. In order to improve efficiency and high yield, PCB board is produced on a large scale in the production process and is cut into small pieces during use. The ways to cut PCB into small board are milling cutter, walking knife, punching cutting, saw cutting, laser cutting.
As the PCB board in mobile phones and other consumer electronics, automotive electronics in the increasingly high degree of requirements, cutting edge no dust, no burr, no deformation, will not affect the edge components become the mainstream requirements, the traditional processing mode milling cutter, cutting, cutting, sawing and other modes will affect the PCB board to different degrees. The non-contact processing mode of laser cutting equipment does not produce stress and dust, and the processing gap is particularly small. These advantages make this processing mode stand out and more and more favored by major manufacturers. However, PCB laser cutting machine also has its fatal disadvantage, the processing efficiency is low, compared with the traditional cutting tool, milling cutter processing, processing speed has become its short board.