The application of PCB laser cutting machine technology in PCB industry started earlier, but it is always lukewarm, and can only be used in special industries, such as scientific research, military industry and other fields. The main reason is the early use of CO2 laser cutting, heat impact is greater, low efficiency. With the development of laser technology, more and more light sources are applied to PCB industry, such as ULTRAVIOLET, green light, optical fiber, CO2, etc. On the other hand, the PCB industry is developing towards thin, high integration and high precision. The traditional process has different problems, such as burr, dust, stress, vibration and unable to process curves. Therefore, in the FIELD of PCB, the application advantages of laser cutting and board splitting technology are gradually highlighted. Its advantage is that the non-contact processing has no stress and will not make the plate deformation; No dust; The cutting edge is smooth and neat, without burr; PCB board with components can be processed. Any graphics can be processed. However, the laser technology still has defects and the processing efficiency cannot be compared with the traditional technology, so the laser cutting technology is only applied in the field of high processing precision.