Laser cutting is to use high-energy laser beam to illuminate the workpiece surface,to partially melt and vaporize the exposed area so as to achieve the purpose of slicing.Using fiber laser as working light source,controlled by computer,can do all kinds of motion according to the input graph.High output power, high chip precision, fast speed,can cut curves and straight lines.
Applicable materials and industries
Suitable for single crystal silicon, polycrystalline silicon battery materials,and silicon, germanium, gallium arsenide semiconductor materials slicing and cutting.
The characteristics of laser slicing
Because the laser is focused by a special optical system into a very small point of light, high energy density.Because of its non - contact processing, minimal thermal impact, high precision, widely used in solar panels, thin metal chip slicing and cutting.
1. High configuration
Using 30W fiber laser, good beam quality, finer cutting seam, smooth edge.
2. No maintenance
Adopts standard modular design, no maintenance, continuous running without interruption, no consumable parts replacement.
3. Convenient operation
Integrated air - cooling Settings, smaller equipment volume, easier operation.
4. Special control software
Control software specially designed for laser scribing machine,easy to operate, can display the scribing path in real time.
5. High efficiency
High speed and adjustable,can run for 24 hours.
6. Brand-new design
Simpler device structure and easier to use,software runs more stable and fast.
|Laser type||Fiber laser|
|Scribing line width||≤30μm|
|Laser repetition frequency||30KHz~60KHz|
|Maximum Scribing speed||stepper≤200mm/s,servo≤300mm/s|
|Cooling system||Air cooling|